Semiconductor Processes and Integration [Yung-Chun Wu] 9786267533420

Semiconductor Processes and Integration is a comprehensive book that systematically covers semiconductor fabrication and integration technologies across multiple generations of transistor architectures, including MOSFETs, FinFETs, GAAFETs, and CFETs. This book's academic contribution lies in modernizing teaching materials and bridging the gap between industry and academia. This book contains 14 chapters. It begins with the fundamentals of semiconductor materials and physics, followed by detailed discussions of key unit processes such as oxidation, lithography, ion implantation, etching, CVD, metallization, and planarization.
The text further explores advanced process integration for both 2D planar and 3D FinFET devices, incorporating modern innovations such as strained silicon channels, high-k gate dielectrics, and metal gate technologies. Additionally, it introduces essential material characterization techniques, including SEM, TEM, X-ray spectroscopy, and Raman spectroscopy, and extends to emerging trends such as GAAFETs, CFETs, and 3D IC heterogeneous integration. With comprehensive coverage of mass-production technologies developed since 2010, this book serves as an indispensable reference for students, professionals, researchers, and anyone working at the forefront of semiconductor technology.

頁數：496
版次：第1版
年份：2026年
規格：平裝/單色
ISBN：9786267533420

1 Semiconductor Integrated Circuit Development
2 Basic Semiconductor Materials
3 Base Semiconductor Devices
4 Oxidation and Heating Processes
5 Lithography
6 Diffusion and Ion Implantation Process
7 Etching Process
8 Dielectric Films and Chemical Vapor Deposition
9 Metallization Process
10 CMOSFET Process Integration
11 Advanced Device Process
12 FinFET Process Integration
13 Semiconductor Materials Analysis Technology
14 GAAFET and CFET to 3D IC Heterogeneous Integration